收藏本站
您好,
买卖IC网欢迎您。
请登录
免费注册
我的买卖
新采购
0
VIP会员服务
[北京]010-87982920
[深圳]0755-82701186
网站导航
发布紧急采购
IC现货
IC急购
电子元器件
搜 索
VIP会员服务
您现在的位置:
买卖IC网
>
Sheet目录3882
> PIC18F25J10-I/SS (Microchip Technology)IC PIC MCU FLASH 16KX16 28SSOP
63页
64页
65页
66页
[67页]
68页
69页
70页
71页
2009 Microchip Technology Inc.
DS39682E-page 5
PIC18F45J10 FAMILY
Table of Contents
1.0
Device Overview .......................................................................................................................................................................... 7
2.0
Guidelines for Getting Started with PIC18FJ Microcontrollers ................................................................................................... 23
3.0
Oscillator Configurations ............................................................................................................................................................ 27
4.0
Power-Managed Modes ............................................................................................................................................................. 35
5.0
Reset .......................................................................................................................................................................................... 41
6.0
Memory Organization ................................................................................................................................................................. 51
7.0
Flash Program Memory.............................................................................................................................................................. 71
8.0
8 x
8 Hardware Multiplier............................................................................................................................................................ 81
9.0
Interrupts .................................................................................................................................................................................... 83
10.0 I/O Ports ..................................................................................................................................................................................... 97
11.0 Timer0 Module ......................................................................................................................................................................... 115
12.0 Timer1 Module ......................................................................................................................................................................... 119
13.0 Timer2 Module ......................................................................................................................................................................... 125
14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 127
15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 135
16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 149
17.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 193
18.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 215
19.0 Comparator Module.................................................................................................................................................................. 225
20.0 Comparator Voltage Reference Module................................................................................................................................... 231
21.0 Special Features of the CPU.................................................................................................................................................... 235
22.0 Instruction Set Summary .......................................................................................................................................................... 249
23.0 Development Support............................................................................................................................................................... 299
24.0 Electrical Characteristics .......................................................................................................................................................... 303
25.0 Packaging Information.............................................................................................................................................................. 337
Appendix A: Revision History............................................................................................................................................................. 349
Appendix B: Migration Between High-End Device Families............................................................................................................... 350
Index .................................................................................................................................................................................................. 353
The Microchip Web Site..................................................................................................................................................................... 363
Customer Change Notification Service .............................................................................................................................................. 363
Customer Support.............................................................................................................................................................................. 363
Reader Response .............................................................................................................................................................................. 364
PIC18F45J10 family Product Identification System ........................................................................................................................... 365
发布紧急采购,3分钟左右您将得到回复。
采购需求
(若只采购一条型号,填写一行即可)
发布成功!您可以继续发布采购。也可以
进入我的后台
,查看报价
发布成功!您可以继续发布采购。也可以
进入我的后台
,查看报价
*
型号
*
数量
厂商
批号
封装
添加更多采购
我的联系方式
*
*
*
快速发布
相关PDF资料
PIC16F88T-E/SS
IC MCU FLASH 4KX14 EEPROM 20SSOP
PIC16C621A-04/SO
IC MCU OTP 1KX14 COMP 18SOIC
PIC16F88T-E/ML
IC MCU FLASH 4KX14 EEPROM 28QFN
PIC16F88T-E/SO
IC MCU FLASH 4KX14 EEPROM 18SOIC
PIC16F882-I/SO
IC PIC MCU FLASH 2KX14 28SOIC
PIC16F87T-E/SS
IC MCU FLASH 4KX14 EEPROM 20SSOP
PIC16F87T-I/ML
IC MCU FLASH 4KX14 EEPROM 28QFN
PIC16F87T-E/ML
IC MCU FLASH 4KX14 EEPROM 28QFN
相关代理商/技术参数
PIC18F25J10T-I/ML
功能描述:8位微控制器 -MCU 32 KB FL 1024 RAM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F25J10T-I/SO
功能描述:8位微控制器 -MCU 32 KB FL 1024 RAM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F25J10T-I/SS
功能描述:8位微控制器 -MCU 16 KB FL 1 KB RAM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F25J11-I/ML
功能描述:8位微控制器 -MCU 32KB Flash 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F25J11-I/SO
功能描述:8位微控制器 -MCU 32KB Flash 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F25J11-I/SP
功能描述:8位微控制器 -MCU 32KB Flash 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F25J11-I/SS
功能描述:8位微控制器 -MCU 32KB Flash 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F25J11T-I/ML
功能描述:8位微控制器 -MCU 32KB Flash 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT